Samtec Inc. FTSH-142-01-L-DH-C
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- FTSH-142-01-L-DH-C
- Samtec Inc.
- .050'' X .050 TERMINAL STRIP
- Rectangular Connectors - Headers, Male Pins
- FTSH-142-01-L-DH-C Fiche technique
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Lead free / RoHS Compliant - 18151
- Stock au comptant / revendeur autorisé / surplus dusine
- Garantie de qualité de 1 an 》
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| Part Number FTSH-142-01-L-DH-C |
| Category Rectangular Connectors - Headers, Male Pins |
| Manufacturer Samtec Inc. |
| Description .050'' X .050 TERMINAL STRIP |
| Package - |
| Series * |
| Features Pick and Place |
| Operating Temperature -55°C ~ 125°C |
| Mounting Type Surface Mount, Right Angle |
| Termination Solder |
| Style Board to Board or Cable |
| Current Rating 3.3A per Contact |
| Contact Material Phosphor Bronze |
| Number of Positions 84 |
| Connector Type Header, Cuttable |
| Number of Positions Loaded All |
| Number of Rows 2 |
| Insulation Color Black |
| Contact Type Male Pin |
| Fastening Type Push-Pull |
| Material Flammability Rating UL94 V-0 |
| Pitch - Mating 0.050" (1.27mm) |
| Shrouding Unshrouded |
| Contact Length - Mating 0.120" (3.05mm) |
| Insulation Height 0.135" (3.43mm) |
| Contact Shape Square |
| Contact Finish - Mating Gold |
| Contact Finish - Post Tin |
| Insulation Material Liquid Crystal Polymer (LCP) |
| Contact Finish Thickness - Mating 10µin (0.25µm) |
| Row Spacing - Mating 0.050" (1.27mm) |
| Package_case - |
FTSH-142-01-L-DH-C Des garanties
• Répondez rapidement
• Qualité garantie
• Accès global
• Prix de marché compétitif
• Services à guichet unique de la chaîne d'approvisionnement
Jinftry, c'est votre fournisseur de composants le plus digne de confiance, bienvenue pour nous envoyer la demande, merci!
Vous avez des questions sur FTSH-142-01-L-DH-C ?
N'hésitez pas à nous contacter:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
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Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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